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TheseachievementsreflecttheoutcomesofSingaporesManufacturing2030vision-anationalstrategytogrowmanufacturingoutputby50%by2030Criticalenablersincludehigh-qualityinfrastructurerobustsupplychainsandapipelineofskilledtalentTodaySingaporessemiconductorworkforcestandsataround35000andcontinuestoexpandintandemwithindustryneedsPublicinvestmenthasalsokeptpaceA$3billiontop-uptotheResearchInnovationandEnterprise(RIE)2025plan-announcedinBudget2024-hasbroughtthetotalR&Dinvestmentforthe2021–2025periodto$28billionThisfundingsupportsinnovationacrossmanufacturingadvancedmaterialsandsemiconductortechnologiesCollaborationisalsocentraltoSingaporesindustrialstrategyInJanuary2025theSingaporeManufacturingFederation(SMF)launchedanewinitiativetoencouragestrongerpartnershipsbetweenmultinationalcorporations(MNCs)andlocalsmallandmedium-sizedenterprises(SMEs)Throughthese win-winalliancesMNCsgainaccesstolocalsupplychainsandmarketagilitywhileSMEsbenefitfromcutting-edgetechnologiesandglobalnetworksAnnouncedinBudget2025asignificantcatalyst for furtherinnovation willbetheupcoming$500millionnationalsemiconductor fabrication facilityundertheNationalSemiconductorTranslationandInnovationCentre(NSTIC)Scheduledforcompletionin2027atJTCnanoSpace@Tampinesthisfacilitywilloffercleanroominfrastructureandindustry-gradetoolsInitiallyfocusingonadvancedpackaging-akeyareaofsemiconductorvalue-add-theNSTICfacilitywillenablelocalfirmsandstartupstobuildcapabilitiesco-developcompetitivetechnologiesandcreatehigh-value jobsSingapore-basedstartupsandSMEsseekingglobalgrowthcanalsotapintotheGlobalInnovationAlliance(GIA)administeredbyEnterpriseSingapore(EnterpriseSG)TheGIAsupportsmarketaccessandR&DcollaborationthroughAccelerationProgrammesCo-InnovationProgrammesandtherecentlyintroducedGIA+Initiative-alldesignedtohelpSingaporetechfirmsscalethroughinternationalpartnershipsSemiconductorR&DDefiningTechnologicalTrendsAs artificial intelligence (AI) evolves rapidly the demand for smarter faster and more energy-efficient hardware is transforming the semiconductorlandscapeSingaporessemiconductorR&DeffortsareincreasinglyfocusedonadvancingchipdesignwhileenhancingmanufacturingprocessesandcapabilitiesOnekeyinnovationareaisheterogeneousintegration-apackagingapproachthatcombinesdifferentchipletsintoasinglepackagetoachievehigherperformancereducedpowerconsumptionandsmallerformfactorsThistechniqueishelpingtheindustrymovebeyondthetraditionallimitsofMooresLawwhichpredictedthedoublingoftransistorsonachipeverytwoyearsGloballeaderslikeTaiwanSemiconductorManufacturingCompany(TSMC)havealreadypioneeredpackagingtechnologiessuchaschip-on-wafer-on-substrate(CoWoS)and3DchipstackingsettingnewstandardsforefficiencyandintegrationHigh-bandwidthmemory(HBM)hasalsoemergedasacornerstoneofAI-readychiparchitecturesOriginallydevelopedbySamsungAMDandSKHynixHBMdelivers thespeedbandwidthandenergyefficiencyneeded topower AImodelsacrossbothcloudandedgeenvironments Aslargelanguagemodels(LLMs)andreal-timeanalyticscontinuetoexpanddemandforthesememorysolutionsisexpectedtoremainstrongThenextwaveofinnovationisalreadytakingshapeInJanuary2025researchersattheKoreaAdvancedInstituteofScienceandTechnology(KAIST)unveiledaneuromorphicchip-abreakthroughinspiredbythestructureofthehumanbrainUnlikeconventionalchipswhichseparateprocessingandmemoryneuromorphicchipsaredesignedtoprocessinformationandstoreitsimultaneouslyThisdesignmimicshowthebrainlearnsandself-correctsofferingunprecedentedpotentialforAIperformanceandenergyefficiencyInparallelthegreeningofdatacentresisgainingmomentumWithAIworkloadsdrivingsoaringpowerconsumptionnewmaterialslikesiliconcarbide(SiC)andgalliumnitride(GaN)havebecomeessentialforenergy-efficientsemiconductorcomponentsComparedtotraditionalsiliconSiCandGaNofferlowerenergylossesandhigherheatresistanceSTMicroelectronicsoneoftheworldstopsemiconductorproducersalreadymanufacturesSiCchipsinSingapore-advancingthecountrysleadershipinsustainableelectronicsThesedevelopmentshighlightthestrategicroleofR&DnotjustinpushingtechnologicalboundariesbutinshapingmoresustainablescalableandAIreadysemiconductorecosystemsForcompaniesbasedinSingapore-whethermultinationalorstartup-thesetrendspresenttimelyopportunitiestoleadcollaborateandinnovateontheglobalstageSemiconductorManufacturingTransitingtoIndustry50Sustainabilitypersonalisationandcollaboration-thesearethedefiningprinciplesofIndustry50theemergingparadigmthatplaceshuman-centricinnovationandenvironmentalresponsibilityattheheartoftechnologicalprogressWhileIndustry40focusedondigitalisationautomationanddataIndustry50seekstoharmonisetechnologicaladvancementwithhumancreativityandlong-termsustainabilitySINGAPOREELECTRONICSINDUSTRYDIRECTORY2025/20267