Precision Die-Cutting

In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die. In between those functional parts of the circuits, a thin non-functional… More

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Machining & Machining Parts  |  Metal Fabrication  |  Precision Machining  |  Precision Turned Parts  |  Tools & Dies


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