Precision Die-Cutting

In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die. In between those functional parts of the circuits, a thin non-functional… More

Related Categories
Machining & Machining Parts  |  Metal Fabrication  |  Precision Machining  |  Precision Turned Parts  |  Tools & Dies

Companies

6 companies found

THERMAL INTERFACE PAD

Marian narrowed down the many thermal management material choices to a proven material that was clean and conducted heat well. The thermal interface pad offered a more uniform coverage of the LED board surface area, which meant that the transfer of… More

 

CUSTOM FLEXIBLE COMPONENT

Poron or Foam Gasket EMI Shield Thermal Gap Pad Adhesive Pattern Audio/Dust Fabric Filter Kapton Insulator Graphic Overlay

 

CHMSL GASKET

Selected the appropriate materials to meet the customer's specifications Utilised multi-layer lamination technology Created kiss-cut part on extended liner for ease of assembly at our customer's Plant Developed tabs on both sides of flexible part Consistently… More