Precision Die-Cutting

In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die. In between those functional parts of the circuits, a thin non-functional… More

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Machining & Machining Parts  |  Metal Fabrication  |  Precision Machining  |  Precision Turned Parts  |  Tools & Dies

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SOLUTIONS FOR WATERPROOF CONSUMER ELECTRONICS

Consumer electronics are becoming more integrated into our daily lives which exposes them to more elements than ever before. Dynamics device designs require water-resistant and waterproof assemblies to protect the precious internal components from… More

 

SOLUTIONS FOR TOUCHSCREENS AND DISPLAYS

Touchscreens and interactive displays are made of many layers of thin and intricate materials. As shown, Marian has the capabilities to create custom die-cut components used throughout the construction of touchscreen displays. Our teams are ready… More

 

GASKETS AND SEALS FOR HEV BATTERY ENCLOSURE

CHALLENGE The customer’s design for an HEV battery system included an enclosure that required a group of seals and gaskets that would protect the sensitive contents of the enclosure from moisture, dust, and debris. Additionally, the design required… More