Integrated Circuit Leadframes

Lead frames are the metal structure inside a chip package that carry signals from the die to the outside. The die inside the package is typically glued to a lead frame, and bond wires then attached from the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and the outside of the lead frame cut-off, separating all leads.

Lead frames are the metal structure inside a chip package that carry signals from the die to the outside. The die inside the package is typically glued to a lead frame, and bond wires then attached from the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and the outside of the lead frame cut-off, separating all leads.