Integrated Circuit Leadframes

Lead frames are the metal structure inside a chip package that carry signals from the die to the outside. The die inside the package is typically glued to a lead frame, and bond wires then attached from the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a plastic case, and the outside of the lead frame cut-off, separating all leads.

Related Categories
Integrated Circuit Assembly & Test  |  Integrated Circuits (ICs)  |  Integrated Circuits (ICs)  |  Semiconductors  |  Semiconductors

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