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| Design, develop and manufacturing of automation machines and manufacturing solutions for advanced semiconductor packaging and smart labels/RFIDs as well as for new developmental products such as optoelectronics, MEMS, photonics industries.
Products include: Flip chip bonders, chip-on-flex line, BGA/CSP solder ball attach line, semiconductor/MEMS test handlers, disk media class 100 machines,... |
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| Miwa has embarked on numerous automation projects (from design to installation) back up by professionals support from Japan.
• Laser and handling system
• Laser welding/marking handler
• Vision checking system
• Dust collector (clean room/normal)
• Automation robotic system
• PC control/PLC control software creation
• Auto spray system
• Custom-made machine and equipment (clean... |
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